The PVA TePla Evolution II Scanning Acoustic Microscope (SAM) provides imaging of interior layers of a device and is used in detecting defects such as delaminations, adhesion artifacts, voids, bubbles, holes, cracks, particles, inclusions, etc. SAM is an important tool for non-destructive failure analysis (back end, front end), reliability testing of components, process and production control, vendor qualification, quality control, and R&D. SAM can perform non-destructive testing of plastic encapsulated IC packages, grid ball arrays, flip-chip packages, bonded wafers, printed circuit boards, capacitors and resistors, ceramics/metals/ glasses/plastic components, power electronics, hybrid devices, medical devices, structures, and more.
System Capabilities:
- Maximum scan area of 30 cm x 30 cm
- Lateral resolution down to 5 渭m depending on transducer, sample material and thickness
- Low, medium, and high frequency transducers: 15MHz, 50MHz, 100MHz, 230MHz, and 300MHz acoustic lens
- Pulse-echo and through scan imaging modes
- All standard pulse echo modes such as C, B, A, diagonal, G, X, tray scans