The Baker Hughes Phoenix Nanome|x is ultra high-resolution nanofocus X-ray imaging system for non-destructive 2D inspection
as well as for full 3D computed tomography. This technique is used extensively for
failure analysis (back end, front end), reliability testing of components, process
and production control, vendor qualification and quality control, and research and
development. It can provide non-destructive evaluation of IC packages, grid ball arrays,
flip chip packages, printed circuit boards, connectors, ceramic/metal/glass/plastic
components just to name a few.
Our Phoenix system has modules for semi-automatic inspection of solder joints and electronic components such as BGAs, CSPs, QFPs, QFNs, PTHs, and voiding and wire sweep calculations.
System Capabilities:
- Max. inspection area of 18“ x 14“
- Max. magnification up to 13,300x
- Detail detectability of <1 µm
- Max. tube voltage of 160 kV
- Max. power of 30 W
- 12- bit and a 16-bit detectors
- Automated voiding, BGA, wire sweep calculation for multi-chip modules