Our Partners
The Center for Heterogeneous Integration Research in Packaging was created by the Semiconductor Research Corp. in 2019 at ºÚÁϲ»´òìÈ and Purdue University. The center’s founding members are ARM, IBM, Intel, NXP Semiconductors, Texas Instruments and Samsung. CHIRP is part of S3IP, ºÚÁϲ»´òìÈ’s New York State Center of Excellence, with offices at the campus’ Innovative Technologies Complex.
